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| (R) TN25 and TYNx25 Series 25A SCRS A STANDARD Table 1: Main Features Symbol IT(RMS) VDRM/VRRM IGT Value 25 600 to 1000 40 Unit A V mA A G K A DESCRIPTION The standard TN25 / TYNx25 25A SCR series is suitable for general purpose applications. Using clip assembly technology, they provide a superior performance in surge current capabilities. KA G K A G D2PAK (TN25-G) TO-220AB (TYN25) Table 2: Order Codes Part Numbers TN2540-x00G TN2540-x00G-TR TYNx25RG Table 3: Absolute Ratings (limiting values) Symbol IT(RMS) IT(AV) ITSM It dI/dt IGM PG(AV) Tstg Tj VRGM Parameter RMS on-state current (180 conduction angle) Average on-state current (180 conduction angle) Non repetitive surge peak on-state current It Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr 100 ns Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range Maximum peak reverse gate voltage tp = 8.3 ms tp = 10 ms tp = 10 ms F = 60 Hz tp = 20 s Tc = 100C Tc = 100C Tj = 25C Tj = 25C Tj = 125C Tj = 125C Tj = 125C Value 25 16 314 300 450 50 4 1 - 40 to + 150 - 40 to + 125 5 Unit A A A A2S A/s A W C V Marking TN2540x00G TN2540x00G TYNx25 February 2006 REV. 5 1/7 TN25 and TYNx25 Series Tables 4: Electrical Characteristics (Tj = 25C, unless otherwise specified) Symbol IGT VGT VGD IH IL dV/dt VTM Vt0 Rd IDRM IRRM VD = VDRM IT = 500 mA IG = 1.2 x IGT VD = 67 % VDRM Gate open ITM = 50 A tp = 380 s Tj = 125C Tj = 25C Tj = 125C Tj = 125C Tj = 25C Tj = 125C RL = 3.3 k Gate open Tj = 125C Test Conditions MIN. VD = 12 V RL = 33 MAX. MAX. MIN. MAX. MAX. MIN. MAX. MAX. MAX. MAX. 4 mA Value 4 40 1.3 0.2 50 90 1000 1.6 0.77 14 5 Unit mA V V mA mA V/s V V m A Threshold voltage Dynamic resistance VDRM = VRRM Table 5: Thermal resistance Symbol Rth(j-c) Rth(j-a) Junction to case (DC) Junction to ambient (DC) S = 01 cm D2PAK TO-220AB Parameter Value 1.0 45 60 Unit C/W C/W S = Copper surface under tab. Figure 1: Maximum average power dissipation versus average on-state current P(W) 24 22 20 18 16 14 12 10 8 6 4 2 0 0 2 4 6 360 = 180 Figure 2: Average and D.C. on-state current versus case temperature IT(AV)(A) 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 D.C. = 180 IT(AV)(A) 8 10 12 14 16 18 Tcase(C) 0 25 50 75 100 125 2/7 TN25 and TYNx25 Series Figure 3: Average and D.C. on-state current versus ambient temperature (copper surface under tab: S=1cm2) (D2PAK) IT(AV)(A) 4.0 3.5 3.0 D.C. Figure 4: Relative variation of impedance versus pulse duration thermal K=[Zth/Rth] 1.00 Zth(j-c) 2.5 2.0 1.5 1.0 0.5 0.0 0 25 50 = 180 0.10 Zth(j-a) Tamb(C) 75 100 125 tp(s) 0.01 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Figure 5: Relative variation of gate trigger current, holding current and latching current versus junction temperature IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25C] 2.5 Figure 6: Surge peak on-state current versus number of cycles ITSM(A) 350 300 tp=10ms 2.0 250 One cycle 1.5 IGT 200 IH & IL Non repetitive Tj initial=25C 1.0 150 100 Repetitive TC=100C 0.5 50 0.0 -40 -20 0 20 Tj(C) 40 60 80 100 120 140 Number of cycles 0 1 10 100 1000 Figure 7: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms, and corresponding values of It ITSM(A), I2t (A2s) 2000 Tj initial = 25C Figure 8: On-state characteristics (maximum values) ITM(A) 300 Tj max.: Vt0=0.77V Rd=14m 1000 ITSM 100 Tj=max I2t 10 dI/dt limitation Tj=25C tp(ms) 100 0.01 0.10 1.00 10.00 1 0.0 0.5 1.0 1.5 VTM(V) 2.0 2.5 3.0 3.5 4.0 4.5 3/7 TN25 and TYNx25 Series Figure 9: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board FR4, copper thickness: 35m) (D2PAK) Rth(j-a)(C/W) 80 70 60 50 40 30 20 10 S(cm) 0 0 4 8 12 16 20 24 28 32 36 40 Figure 10: Ordering Information Scheme (TN25 series) TN 25 40 - 600 G (-TR) Standard SCR series Current 25 = 25A Sensitivity 40 = 40mA Voltage 600 = 600V 800 = 800V 1000 = 1000V Package G = D2PAK Packing mode Blanck = Tube -TR = Tape & Reel Figure 11: Ordering Information Scheme (TYN25 series) TYN Standard SCR series Voltage 6 = 600V 8 = 800V 10 = 100V Current 25 = 25A Packing mode RG = Tube 6 25 RG 4/7 TN25 and TYNx25 Series Table 6: Product Selector Part Numbers TN2540-xxxG TYNx25 Voltage (xxx) 600 V X X 800 V X X 1000 V X X Sensitivity 40 mA 40 mA Package D2PAK TO-220AB Figure 12: D2PAK Package Mechanical Data DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 4.30 4.60 0.169 2.49 2.69 0.098 0.03 0.23 0.001 0.70 0.93 0.027 1.25 1.40 0.048 0.055 0.45 0.60 0.017 1.21 1.36 0.047 8.95 9.35 0.352 10.00 10.28 0.393 4.88 5.28 0.192 15.00 15.85 0.590 1.27 1.40 0.050 1.40 1.75 0.055 0.40 0.016 0 8 0 REF. A E L2 C2 D L L3 A1 B2 B G A2 2mm min. FLAT ZONE R C V2 A A1 A2 B B2 C C2 D E G L L2 L3 R V2 Max. 0.181 0.106 0.009 0.037 0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 8 Figure 13: D2PAK Foot Print Dimensions (in millimeters) 16.90 10.30 1.30 5.08 3.70 8.90 5/7 TN25 and TYNx25 Series Figure 14: TO-220AB Package Mechanical Data DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 15.20 15.90 0.598 3.75 0.147 13.00 14.00 0.511 10.00 10.40 0.393 0.61 0.88 0.024 1.23 1.32 0.048 4.40 4.60 0.173 0.49 0.70 0.019 2.40 2.72 0.094 2.40 2.70 0.094 6.20 6.60 0.244 3.75 3.85 0.147 15.80 16.40 16.80 0.622 0.646 2.65 2.95 0.104 1.14 1.70 0.044 1.14 1.70 0.044 2.60 0.102 REF. B OI L F A I4 l3 a1 l2 c2 b2 C a2 M b1 e c1 A a1 a2 B b1 b2 C c1 c2 e F OI I4 L l2 l3 M Max. 0.625 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 0.661 0.116 0.066 0.066 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 7: Ordering Information Ordering type TN2540-x00G TN2540-x00G-TR TYNx25RG Note: x = voltage Marking TN2540x00G TN2540x00G TYNx25 Package D2PAK D2PAK TO-220AB Weight 1.5 g 1.5 g 2.3 g Base qty 50 1000 50 Delivery mode Tube Tape & reel Tube Table 8: Revision History Date Apr-2002 13-Feb-2006 Revision 4A 5 Last update. TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. Description of Changes 6/7 TN25 and TYNx25 Series Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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